Presenting a fully automated wafer grinding solution for hard-to-grind materials from Engis Corporation, USA. This state-of-the-art offering, with fully automatic enhanced multi-spindle grinding system (Engis’s Hyprez® EAG Model), provides a low capital and operating expenditure solution for high precision wafering, giving an economic benefit to customers.
The machine includes non-contact, in-situ thickness measurement techniques for targeted wafer thickness control. The aim is to produce ultra-flat wafers in a fully automatic cassette-to-cassette operation for grinding SiC wafers on both sides and to develop tailored ‘Grind-to-CMP Processes’ for all wafers sliced by any wafering techniques.
Please contact us for more information on Wafer Processing Systems from Engis Corp. USA.
Engis® ElectroMill® Diamond Milling Tool – One Tool, Endless Possibilities
The flat machining of bi‐metal surfaces or milling applications involving an interrupted cut can present daunting challenges to PCD or carbide milling cutters. The inserts may chip during the milling process, resulting in high machining costs and elevated levels of sub‐standard or rejected parts. The Engis ElectroMill is designed to produce high quality, flat milled surfaces, even if an interrupted cut is present or multiple materials need to be machined simultaneously. It effectively replaces expensive, complex cutters in high volume applications such as high strength alloys, stainless steel, ceramics, cast iron, fiberglass pipe, composites and aluminum.
Features and benefits include high stock removal rates, stress-free cutting action, extended tool life, industry standard adapter mountings and milling cutting dimensions. Additionally, superabrasives deliver longer tool life than conventional milling technology.
Combined with high pressure coolant, the ElectroMill can machine several materials to an extremely accurate value of flatness with very low tooling costs. On cast iron, this hybrid tool can achieve flatness of up to 20 µm and surface finishes as smooth as 8 Ra over a single continuous length of 25,000 inches. In some cases, customers have been able to reduce scrap and reworks significantly; this contributes to increased productivity and an improved bottom line.
The Engis ElectroMill is designed to produce high quality, flat milled surfaces including interrupted cuts or machining bi-metallic materials
Engis Corporation, an industry leader respected throughout the world for providing high-quality superabrasive finishing systems, showcased the ElectroMill Diamond Milling Tool at the recently held IMTEX 2025 Exhibition, as part of its Electrogrip® superabrasive solutions.
The flat machining of bi‐metal surfaces or milling applications involving an interrupted cut can present daunting challenges to PCD or carbide milling cutters. The inserts may chip during the milling process, resulting in high machining costs and elevated levels of sub‐standard or rejected parts. The Engis ElectroMill is designed to produce high quality, flat milled surfaces, even if an interrupted cut is present or multiple materials need to be machined simultaneously. It effectively replaces expensive, complex cutters in high volume applications such as high strength alloys, stainless steel, ceramics, cast iron, fiberglass pipe, composites and aluminum.
Features and benefits include high stock removal rates, stress-free cutting action, extended tool life, industry standard adapter mountings and milling cutting dimensions. Additionally, superabrasives deliver longer tool life than conventional milling technology.
Combined with high pressure coolant, the ElectroMill can machine several materials to an extremely accurate value of flatness with very low tooling costs. On cast iron, this hybrid tool can achieve flatness of up to 20 µm and surface finishes as smooth as 8 Ra over a single continuous length of 25,000 inches. In some cases, customers have been able to reduce scrap and reworks significantly; this contributes to increased productivity and an improved bottom line.
ElectroMill has been used successfully in the marine, small engine automotive, off-road, agriculture, aerospace and defense industries, as well as ferrous, non-ferrous and exotic materials.
Please contact us for more information on the new Engis Electromill Diamond Milling Tools.
Engis Corporation technology has contributed to the powerful cutting-edge technology that is enabling the recently launched James Webb Space Telescope to answer questions about our solar system, study exoplanets in new ways, and look deeper into the universe than we’ve ever been able to.
Much of what powers JWST’s ability to see deep into space comes from its 21-foot-wide primary mirror which is comprised of 18 segments made from Beryllium.
Beryllium is a light metal that is very strong for its weight and is good at holding its shape across a range of temperatures. Because beryllium is very difficult to grind and polish, diamond machining processes were used to fabricate the mirror segments. Before the segments were coated with a thin layer of gold the segments were polished by L3 Tinsley Laboratories using specially developed Engis diamond abrasive products.
With Engis HYPREZ Lapping & Polishing Systems, we can engineer the right solution to meet your lapping application challenge. Whether you’re looking for a complete lapping and polishing system or simply a lapping machine, lapping plate,diamond slurry or tube of compound, we can satisfy your needs. With decades of experience in lapping and polishing, Engis offers complete solutions which include machine design, machine accessories and consumables that work in harmony achieving the best possible part quality at the lowest overall cost.
Engis Flat Lapping and Polishing systems are capable of consistently generating extreme flatness with 0.5 nm RA surface finishing or better. Our systems are suitable for processing virtually all solid materials, including metals, ceramics, glass, semiconductor substrates, advanced materials and electro-optical materials.
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